Future Challenges in Testing Silicon Photonics for Co-Packaged Optics
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With higher bandwidth as a main driver Silicon Photonics is aiming to bring PICs to large scale production. Today, for typical photonics devices like optical transceivers current testing methods are well known in both R&D and production. Future CPO devices will require more advanced testing methods, not only very accurate, but also very fast. In this webinar, we will explore the evolving requirements for testing silicon photonics devices, particularly Co-Packaged Optics (CPO). The webinar will start with an intro of the Silicon Photonics trend in the high performance computing market, and why it is selected to be a game changer in large scale production of photonics. Followed by an overview of key challenges in testing CPO devices highlighting both high bandwidth and multi-channel measurement requirements along with a brief look at the Silicon Photonics testing flow, particularly where Anritsu’s solutions are focused. Lastly, we will explain different angles of testing PICs including different type of physical level testing in frequency domain with ME7848A, time domain with MP1900A and MP2110A, and on the protocol level with MT1040A, focusing on future requirements of Silicon Photonics.